| 代碼 |
領域 |
| B1 |
Advanced and Green Materials and Process先進與綠色製造材料製程 |
| Green materials(LF、HF、 Energy saving、 Recycling and Reducing etc.) , Green process and manufacturing , Low carbon materials , High frequency and speed materials, Millimeter-wave materials(Low Dk/Df) , Low CTE and low water absorption materials, Thermal dissipation materials, Photonics waveguide materials, Photo and non-photo dielectric materials for high density application, Advanced Substrate materials and process. |
| B2 |
Test, Quality, AOI, Inspection and Reliability測試、品質、自動光學檢測、可靠度技術 |
| Feature Testing and Verification, Inspection(AOI, Non-destructive testing), Electrical evaluation, Structure integrity, Reliability testing and verification, Failure mechanism analysis. |
| B3 |
HDI, IC Substrate and FPC Technology高密度互連技術、IC載板及軟板 |
| SAP and m-SAP process(Fine pitch line), Build-up board, Micro-vias and copper plating process, Multilayer core and coreless , Embedded devices, Advanced flex and rigid-flex, High speed and high frequency circuitry, High power and thermal dissipation substrate technology. |
| B4 |
Smart Manufacturing and Automation 智慧製造及自動化相關 |
| Mechatronics, Robotics, Control systems, Tele-robotics, Human computer(robot) interaction, Modeling and simulation techniques, Intelligent control and manufacturing, Neuro-control, Fuzzy control and their applications, Automatic control system, Process integration . |